Refer to the best practices guide for proper procedures to hand solder Voltera PCBs.
This can happen if the pad has been damaged by excessive heat or soldering time. In these cases, the ink will appear dark brown or black, and solder will ‘ball up’ on the ink. Circuit damage is irreversible, so if this happens you must re-print the circuit.
Temperature control is critical to good soldering!
While the Voltera ink is quite hard after baking, it is also brittle. Applying too much shear stress or torsion will break the ink. Take care when handling soldered components.
For components that will be put under stress, choose through-hole components. This includes connectors, headers, and components such as trimpots or variable resistors that will be adjusted manually.
When reflow soldering on ink it may sometimes appear that the solder has not formed a proper joint. Due to the nature of the conductive ink the wetting and joining behaviour of solder is quite different from copper. There is likely still a good mechanical and electrical connection, even when it may appear unusual.
The built-in Voltera reflow profile should be sufficient for the majority of cases.
Do not leave solder paste on the board for extended periods. Reflow the board immediately after dispensing or applying solder paste for best results.
Reflow soldering PCBs with high thermal mass or using a different solder paste may require a different reflow profile. Use the Manual Reflow feature to tune your reflow profile as desired.
Our customer support team is here to help.